| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having a less moisture permeability as its molded material and a good molding property, and a hollow package made from the resin for housing a solid image-picking up element, excellent in airtightness and waterproof property by using the same. SOLUTION: This epoxy resin composition is characterized by containing an epoxy resin, a curing agent, a curing accelerator, an inorganic filler and porous carbon having≥0.5 m<SP>2</SP>/g and≤30 m<SP>2</SP>/g specific surface area, and≥3μm and≤50μm mean particle diameter. The content of the porous carbon is preferably≥2 mass % and≤30 mass % based on the total amount of the epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI
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