发明名称 SUBSTRATE PROCESSING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide substrate processing equipment capable of clean processing of a substrate. SOLUTION: The substrate processing equipment 10A employing microwave plasma is provided with an internal partition wall 15 in a processing vessel 11. Interior of the processing vessel 11 is separated into a space 11A including a substrate to be processed, and a space 11B being defined by the internal partition wall 15 and the outer wall of the processing vessel 11. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004335790(A) 申请公布日期 2004.11.25
申请号 JP20030130544 申请日期 2003.05.08
申请人 OMI TADAHIRO;TOKYO ELECTRON LTD 发明人 OMI TADAHIRO;HIRAYAMA MASAKI
分类号 C23C16/511;H01J37/32;H01L21/00;H01L21/205;H01L21/3065;(IPC1-7):H01L21/205;H01L21/306 主分类号 C23C16/511
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