发明名称 |
SUBSTRATE PROCESSING EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide substrate processing equipment capable of clean processing of a substrate. SOLUTION: The substrate processing equipment 10A employing microwave plasma is provided with an internal partition wall 15 in a processing vessel 11. Interior of the processing vessel 11 is separated into a space 11A including a substrate to be processed, and a space 11B being defined by the internal partition wall 15 and the outer wall of the processing vessel 11. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004335790(A) |
申请公布日期 |
2004.11.25 |
申请号 |
JP20030130544 |
申请日期 |
2003.05.08 |
申请人 |
OMI TADAHIRO;TOKYO ELECTRON LTD |
发明人 |
OMI TADAHIRO;HIRAYAMA MASAKI |
分类号 |
C23C16/511;H01J37/32;H01L21/00;H01L21/205;H01L21/3065;(IPC1-7):H01L21/205;H01L21/306 |
主分类号 |
C23C16/511 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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