发明名称 Capacitors including a cavity containing a buried layer and methods of manufacturing the same
摘要 Capacitors include an integrated circuit (semiconductor) substrate and an interlayer dielectric disposed on the integrated circuit substrate and including a metal plug therein. A lower electrode is disposed on the interlayer dielectric and contacting the metal plug. The lower electrode includes a cavity therein and a buried layer in the cavity. The buried layer is an oxygen absorbing material. A dielectric layer disposed on the lower electrode and an upper electrode is disposed on the dielectric layer. The lower electrode may be a noble metal layer. The buried layer may fill in the cavity and may not contain oxygen (O2) when initially formed.
申请公布号 US2004232463(A1) 申请公布日期 2004.11.25
申请号 US20040795020 申请日期 2004.03.05
申请人 CHUNG SUK-JIN;KIM WAN-DON;YOO CHA-YOUNG;LEE KWANG-HEE;LIM HAN-JIN;LEE JIN-IL 发明人 CHUNG SUK-JIN;KIM WAN-DON;YOO CHA-YOUNG;LEE KWANG-HEE;LIM HAN-JIN;LEE JIN-IL
分类号 H01L21/8242;H01L21/02;(IPC1-7):H01L29/74 主分类号 H01L21/8242
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