| 摘要 |
It is an object of the present invention to provide a copper electroplating method for a printed circuit board having via-holes, which can reproducibly secure good plated film quality and via-hole filling capacity even when the board includes a resist or the like. The electroplating bath for electroplating of a printed circuit board, containing at least one compound selected from the group consisting of pyridinium, bipyridinium, phenanthrolinium, quinolinium and phenazinium salts in the form of onium with an N-alkyl, N-aralkyl, N-aryl, N-alkylene or N-aralkylene moiety.
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