Dielectric focus ring for wafer located in processing position on electrostatic chuck in plasma etching installation with potential difference between wafer potential and focus ring potential

摘要

Dielectric focus ring (10) is intended for wafer (2) in processing position on electrostatic chuck (3) in plasma etching appliance. Chuck contains electric contact with electrode. Between focus ring potential and wafer potential can exist potential difference .Structure (11) for targeted influencing of potential profile inside focus ring contains at least one material with other property than dielectric part of focus ring, such as other dielectric constant and/or conductivity.