METAL PATTERNING METHOD USING SOLID BRIDGE

摘要

A method for forming a metal pattern using a solid bridge is provided to form a metal electrode pattern without performing an exposure process and an etch process. A molding layer is formed on a master mold. A supporting layer is formed on the molding layer. A stamp(110) is formed by hardening the molding layer and the supporting layer. The stamp is separated from the master mold. A metal oxide layer is formed on a surface of the stamp. A transfer target substrate(107) is prepared. A metal oxide layer is formed on the transfer target substrate. The stamp comes in contact with the transfer target substrate. The stamp is separated from the transfer target substrate.