发明名称 |
Wiring forming system and wiring forming method for forming wiring on wiring board |
摘要 |
A wiring forming system comprises: maskless exposure unit which directly exposes an unexposed board by using exposure data generated based on design data relating to an wiring board; post-development inspect unit which tests the board after development, by using the exposure data and the image data of the board exposed and developed by the maskless exposure unit; etching unit which etches the developed board; and post-etching inspect unit which tests an etching pattern formed on the etched board, by using etching inspect data generated. based on the design data and the image data of the board etched by the etching unit. <IMAGE> |
申请公布号 |
EP1367871(A3) |
申请公布日期 |
2004.11.24 |
申请号 |
EP20030253262 |
申请日期 |
2003.05.23 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO. LTD. |
发明人 |
AKAGAWA, M.;SEKIGAWA, K;WAKABAYASHI, S. |
分类号 |
G01N21/956;G03F7/207;G03F9/00;H01L23/12;H05K1/02;H05K3/00;H05K3/06;H05K3/10;H05K3/12;H05K3/46 |
主分类号 |
G01N21/956 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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