发明名称 |
Semiconductor wafer, method of manufacturing the same, and method of manufacturing a semiconductor device |
摘要 |
In a semiconductor wafer including a plurality of element forming regions formed on a front surface of a semiconductor substrate, a scribe line groove is formed along a periphery of the each of the element forming regions, and stoppers are located at an intersection of the scribe line groove, so as to block the scribe line groove. |
申请公布号 |
US2008070381(A1) |
申请公布日期 |
2008.03.20 |
申请号 |
US20070980573 |
申请日期 |
2007.10.31 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
ONUMA MANABU |
分类号 |
G03F1/08;H01L21/304;G03F1/00;G03F1/70;H01L21/301;H01L21/78 |
主分类号 |
G03F1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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