| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high-performance and low-cost photomodule. SOLUTION: A photomodule is composed of a semiconductor waveguide path type of photoamplifier 101, an end face incidence refraction type of photodiode 102, and a sub-mount 103. The light incidence end face 101a and the light emission end face 101b of the optical amplifier are made by cleavage, and they are put on the same plane as the end face on semiconductor side of the photoamplifier. Though a light incidence end face 102a is made on the same plane as the end face on semiconductor side in the photodiode 102, a depressed part 102 is made, being depressed inward more than the face on semiconductor side, in the section where an optical axis passes besides being one part of the light incidence end face 102a. A step part 103a which aligns the optical axes by complementing the step between the optical axes of the photoamplifier 101 and the photodiode 102 is made in the sub-mount 103. The photoamplifier 101 and the photodiode 102 are made arranged and mounted at the step part 103a of the sub-mount 103, bringing the light emission end face 101b and the light incidence end face 102a being each end face on semiconductor side into contact with each other, with semiconductor substrate side up and device layer side down.</p> |
