发明名称 |
Area-array device assembly with pre-applied underfill layers on printed wiring board |
摘要 |
The invention provides a method of attaching an area-array device such as a bumped flip chip to an electrical substrate. An underfill material is applied to a portion of the electrical substrate, and the underfill material is heated to an underfill-material staging temperature. A bumped area-array device is provided, the bumped area-array device including an interconnection surface and a plurality of connective bumps extending from the interconnection surface. The interconnection surface of the bumped area-array device is positioned adjacent the applied underfill material. The bumped area-array device is heated to electrically connect the connective bumps to the electrical substrate. The invention also provides a flip-chip assembly and a printed wiring board panel with pre-applied underfill material.
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申请公布号 |
US6821878(B2) |
申请公布日期 |
2004.11.23 |
申请号 |
US20030376405 |
申请日期 |
2003.02.27 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
DANVIR JANICE;QI JING |
分类号 |
H01L21/56;H01L21/60;H01L23/485;H05K3/28;H05K3/30;H05K3/34;(IPC1-7):H01L21/44;H01L21/48 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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