发明名称 |
Method of packaging and assembling micro-fluidic device |
摘要 |
A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
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申请公布号 |
US6821819(B1) |
申请公布日期 |
2004.11.23 |
申请号 |
US20030370543 |
申请日期 |
2003.02.20 |
申请人 |
SANDIA CORPORATION |
发明人 |
BENAVIDES GILBERT L.;GALAMBOS PAUL C.;EMERSON JOHN A.;PETERSON KENNETH A.;GIUNTA RACHEL K.;ZAMORA DAVID LEE;WATSON ROBERT D. |
分类号 |
H01L23/433;H01L23/473;(IPC1-7):H01L21/44;H01L21/48;H01L21/50;H01L21/00 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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地址 |
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