发明名称 |
Assembly of opto-electronic module with improved heat sink |
摘要 |
A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.
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申请公布号 |
US6822875(B2) |
申请公布日期 |
2004.11.23 |
申请号 |
US20020281036 |
申请日期 |
2002.10.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHAN BENSON;FORTIER PAUL FRANCIS;FREITAG LADD WILLIAM;GALLI GARY T.;GUINDON FRANCOIS;JOHNSON GLEN WALDEN;LETOURNEAU MARTIAL;SHERMAN JOHN H.;TETREAULT REAL |
分类号 |
H01S5/024;G02B6/42;H01L23/373;(IPC1-7):H05K7/10 |
主分类号 |
H01S5/024 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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