发明名称 |
Method of manufacturing a circuit board and its manufacturing apparatus |
摘要 |
It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.
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申请公布号 |
US6820331(B2) |
申请公布日期 |
2004.11.23 |
申请号 |
US20000736499 |
申请日期 |
2000.12.15 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
KISHIMOTO KUNIO;NISHII TOSHIHIRO;TAKENAKA TOSHIAKI;NAKAMURA SHINJI;MIURA AKIHIRO |
分类号 |
H05K3/00;H05K3/40;(IPC1-7):H01K3/10 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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