Method for forming grooves in the scribe region to prevent a warp of a semiconductor substrate

摘要

The present invention provides a semiconductor device and a manufacturing method thereof which can realize fine processing while preventing a warp of a semiconductor wafer. In forming a plurality of semiconductor elements on a semiconductor wafer, grooves for attenuating stress are formed in scribe regions defined between semiconductor element forming regions. Here, the grooves are formed in the scribe regions except for alignment pattern forming regions such that the alignment pattern forming regions remain in the scribe regions. On the alignment pattern forming regions of the scribe regions, an alignment pattern or a TEG pattern which is used in a photolithography step is formed.