发明名称 Semiconductor device, semiconductor substrate, and manufacture method
摘要 Disclosed is a semiconductor device which comprises a substrate in which surface is formed a depression having a closed figure when viewed from the substrate normal and a semiconductor layer which is formed on the surface of the substrate by crystal growth from at least an inside face of the depression.
申请公布号 US6821805(B1) 申请公布日期 2004.11.23
申请号 US20000680054 申请日期 2000.10.05
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 NAKAMURA SHINJI;ISHIDA MASAHIRO;ORITA KENJI;IMAFUJI OSAMU;YURI MASAAKI
分类号 H01L21/18;C30B25/18;H01L21/20;H01L21/205;H01L33/20;H01L33/32;H01S5/02;H01S5/32;H01S5/323;(IPC1-7):H01L21/00 主分类号 H01L21/18
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