Method of regulating the temperature of integrated circuit modules, using a heat exchanger with a face of a solid malleable metal and a release agent

摘要

The temperature of multiple integrated circuit modules is regulated by a heat exchanger which is sequentially squeezed against, and separated from, a respective uneven contact surface on each of the modules. The heat exchanger has a face of a malleable metal that stays in a solid state and deforms while the squeezing occurs. The surface of the malleable metal has a coating of a release agent that prevents the malleable metal from sticking to the contact surface.