发明名称 Apparatus for the transport and equipping of substrates with semiconductor chips
摘要 An apparatus for the transport and equipping of substrates with semiconductor chips comprises a channel with two side walls in which the substrates are transported in a transport direction. The apparatus has at least one comb which can be raised and lowered in order to move the substrates in transport direction as well as resiliently mounted elements which press against the substrates.
申请公布号 US6820793(B2) 申请公布日期 2004.11.23
申请号 US20020209066 申请日期 2002.07.29
申请人 ESEC TRADING SA 发明人 KELLENBERGER DANIEL;SUTER GUIDO
分类号 H01L21/00;(IPC1-7):B23K37/04;B23K1/00;B23K5/00 主分类号 H01L21/00
代理机构 代理人
主权项
地址