| 摘要 |
The mounting of semiconductor chips onto a flexible substrate takes place in three steps: Firstly, at a dispensing station, adhesive is applied to predetermined substrate sites on the substrate. Then, at a bonding station, semiconductor chips are placed onto the substrate sites. Finally, curing of the adhesive takes place. In accordance with the invention, the substrate is fixed onto a level support surface by means of vacuum during the hardening of the adhesive.
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