MOLD FOR ENCAPSULATING SEMICONDUCTOR PACKAGE AND METHOD THEREOF

摘要

PURPOSE: A mold for encapsulating a semiconductor package and a method thereof are provided to minimize the damage of an encapsulation part by supplying and circulating air between the mold and the encapsulation part using a plurality of air holes. CONSTITUTION: A mold for encapsulating a semiconductor package includes a middle frame, a bottom frame, a top frame, and a side frame. The middle frame(110) includes a cavity(112) for loading a substrate, a gate(114) and a runner(116). The bottom frame(130) is installed at a lower portion of the middle frame. A void is formed between the runner and the bottom frame to flow encapsulation material(174). The top frame(120) presses down the substrate to the middle frame. The side frame(150) is used for attaching the top, the middle, and the bottom frames with each other. A plurality of air holes(121,122,123) are formed at the top frame to supply and circulate the predetermined mount of air to the substrate and the encapsulation material.