发明名称 |
TRANSFER APPARATUS AND METHOD FOR UNLOADING SEMICONDUCTOR SUBSTRATE FROM CONTAINER |
摘要 |
PURPOSE: A transfer apparatus and method are provided to unload selectively a plurality of wafers from an FOUP(Front Open Unified Pod) by controlling corresponding vacuum lines of a multi-arm unit using a control unit. CONSTITUTION: A transfer apparatus includes a multi-arm unit, a control unit, and a vacuum pump. The multi-arm unit includes a plurality of blades(420) for adsorbing semiconductor substrates, a fixing body for fixing the blades, a transfer part for moving the fixing body, and a plurality of vacuum lines(450). The control unit is used for controlling the operation of the multi-arm unit. The vacuum pump is connected with the vacuum lines. The vacuum lines are formed in the blades, respectively. The vacuum lines are selectively opened and closed.
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申请公布号 |
KR20040098329(A) |
申请公布日期 |
2004.11.20 |
申请号 |
KR20030030645 |
申请日期 |
2003.05.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG, JIN HYEONG;LIM, BYEONG GI;NAM, SEUNG MAN |
分类号 |
B25J15/00;B25J15/06;H01L21/677;H01L21/683;(IPC1-7):H01L21/68 |
主分类号 |
B25J15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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