发明名称 TRANSFER APPARATUS AND METHOD FOR UNLOADING SEMICONDUCTOR SUBSTRATE FROM CONTAINER
摘要 PURPOSE: A transfer apparatus and method are provided to unload selectively a plurality of wafers from an FOUP(Front Open Unified Pod) by controlling corresponding vacuum lines of a multi-arm unit using a control unit. CONSTITUTION: A transfer apparatus includes a multi-arm unit, a control unit, and a vacuum pump. The multi-arm unit includes a plurality of blades(420) for adsorbing semiconductor substrates, a fixing body for fixing the blades, a transfer part for moving the fixing body, and a plurality of vacuum lines(450). The control unit is used for controlling the operation of the multi-arm unit. The vacuum pump is connected with the vacuum lines. The vacuum lines are formed in the blades, respectively. The vacuum lines are selectively opened and closed.
申请公布号 KR20040098329(A) 申请公布日期 2004.11.20
申请号 KR20030030645 申请日期 2003.05.14
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JANG, JIN HYEONG;LIM, BYEONG GI;NAM, SEUNG MAN
分类号 B25J15/00;B25J15/06;H01L21/677;H01L21/683;(IPC1-7):H01L21/68 主分类号 B25J15/00
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