| 摘要 |
PROBLEM TO BE SOLVED: To provide equipment and method for picking up a thin semiconductor chip capable of preventing cracking and chipping and realizing high productivity. SOLUTION: In a mechanism for stripping a semiconductor chip stuck to a sheet by placing a suction/strip tool 22 against the sheet stuck with the chip and vacuum sucking the sheet from a suction groove 22b thereby flexing and deforming the semiconductor chip along with the sheet, a rotary drive mechanism for rotating the suction/strip tool 22 is controlled such that a boundary part 22d sectioning the suction groove 22b has a specified direction corresponding to the arrangement of peripheral chips. Since the supporting state of a chip (6) being picked up can be set suitably for stripping the sheet, efficiency of pick-up work can be enhanced. COPYRIGHT: (C)2005,JPO&NCIPI
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