MOLDED HIGH DENSITY ELECTRONIC PACKAGING STRUCTURE FOR HIGH PERFORMANCE APPLICATIONS

摘要

The invention discloses a thermally enhanced ball grid array package (200) including a base layer element (202) and a flip chip die (203) mounted on the base layer element (202). The die (203) has a first surface (203a) electrically coupled to the base layer element (202), a second surface (203b) opposite to the first surface (203a), and lateral sides (203c). A molding compound (205) encapsulates the base layer element (202) and the lateral sides (203c) of the die (203). A surface (220) is formed of the second surface (203b) of the die (203) and an upper surface of the molding compound. A material (207) is disposed on the surface (220), and a heat spreader (206) is mounted on the material.