摘要 |
<p><P>PROBLEM TO BE SOLVED: To properly control the manufacturing process of semiconductor devices. <P>SOLUTION: A distribution ratio m of a feedforward control to feedback control is changed with respect to the via-forming process of a semiconductor device A, to obtain the distribution ratio m so that its process capability index Cp is maximized. The feedforward control and the feedback control are combined by the distribution ratio m, to obtain a correction amount of the alignment for an exposure apparatus in the via-forming process. Since a proper correction amount is obtainable in this way, and an effect higher than that in the case of singly using respective one of the feedforward control and the feedback control can be obtained, the semiconductor device A with high quality can be manufactured stably. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |