发明名称 METHOD FOR MANUFACTURING ELECTROLESS-PLATED ELECTROCONDUCTIVE POWDER
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an electroless-plated electroconductive powder, which provides the plated powder superior in dispersibility without damaging the plated powder. SOLUTION: The method for manufacturing the electroless-plated electroconductive powder comprises adding a compound capable of forming a complex ion with an ion of a metal contained in the plated powder, to a dispersion liquid of the plated powder obtained by electroless-plating the surface of a core material powder, to disperse the coagulating plated powder. The compound can form a complex ion with an ion of a metal contained in the core material powder before being electroless plated. The electroless plating is a displacement type electroless plating. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004323964(A) 申请公布日期 2004.11.18
申请号 JP20030124444 申请日期 2003.04.28
申请人 NIPPON CHEM IND CO LTD 发明人 ABE SHINJI;OYAMADA MASAAKI
分类号 B22F1/02;C23C18/36;C23C18/42;H01B1/00;H01B1/02;H01B13/00;(IPC1-7):B22F1/02 主分类号 B22F1/02
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