| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder removing device which removes molten solder while sucking the solder in removing parts soldered to a printed circuit board, etc., and is lightweight and has excellent operability. SOLUTION: A soldering iron section (2) which has a suction opening (3) and can melt the solder at a tip section (6) is formed. The solder removing device (1) is constituted by providing the device with an air blow-off port (9) capable of blowing heated air to the tip section of the soldering iron section (2) and/or the circumference thereof and incorporating a common heater (12) for heating the soldering iron section (2) and the air to be blown off from the port (9) into the device. COPYRIGHT: (C)2005,JPO&NCIPI
|
