IMPROVED STRIPPABLE CABLE SHIELD COMPOSITIONS

摘要

A semiconductive resin composition for use as a semiconductive layer in contact with a crosslinked wire and cable insulation layer is disclosed for use where the insulation layer is crosslinked using a peroxide cure system. The resin has a two component base polymer where the first component has a weight average molecular weight of not more than 200,000. The second component is either a polymer having a melting point between 110°C and 130°C or a nitrile rubber. The composition also has an adhesion modifying compound different from the base polymer and carbon black. Methods of making the composition and cables using the composition are also disclosed.