发明名称 |
VARIABLE GAP THERMAL INTERFACE DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermal interface device ensuring a high thermal conductivity when the interval of nonparallel planes or the interval between a heat source and a heat sink is not uniform, and to provide a method for transmitting heat. SOLUTION: The variable gap thermal interface device comprises a multi-axis rotational spherical joint having a spherical concave surface having a first curvature radius and a spherical convex surface having a curvature radius identical to the first curvature radius where the convex surface and the concave surface touch each other slidably. The variable gap thermal interface device also comprises a block having a proximal end being coupled rotatably with a heat sink through the rotational spherical joint and a distal end on the opposite side. The variable gap thermal interface device further comprises a shim of substantially uniform thickness separating a first surface and a second surface on the opposite side wherein the first surface communicates thermally with the distal end of the block and the second surface communicates thermally with the heat source. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2004327985(A) |
申请公布日期 |
2004.11.18 |
申请号 |
JP20040118924 |
申请日期 |
2004.04.14 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT CO LP |
发明人 |
DELANO ANDREW D;RUBENSTEIN BRANDON A;MIKSCH EUGENE |
分类号 |
H01L23/36;H01L23/433;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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