PRINTED CIRCUIT BOARD, INSULATING LAYER FOR PRINTED CIRCUIT BOARD, AND PREPREG FOR PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To secure enough peel strength of a circuit formed on an insulating layer in a printed circuit board having the insulating layer in which a thermosetting resin is held by an aramid fiber nonwoven fabric substrate, to reduce the water absorption of the insulating layer, to improve the heat resistance when the insulating layer is wet, and also to provide an aramid fiber nonwoven fabric substrate insulating layer and a prepreg for the printed circuit board. SOLUTION: In the printed circuit board having the insulating layer of an aramid fiber nonwoven fabric substrate heat-curable resin, a resin layer which contains no aramid fibers and has a thickness of at least 3μm preferably at least 5μm is formed on the surface of the insulating layer. The insulating layer having the resin layer can be constituted easily by making the bulk density of the armid fiber nonwoven fabric substrate at least 400 kg/m3and heating/pressing/molding a prepreg layer having a resin content of at least 60 mass%. COPYRIGHT: (C)2005,JPO&NCIPI