WIRING BOARD, ITS MANUFACTURING PROCESS, SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a wiring board in which a bump electrode formed on conductor wiring is held with a practically sufficient strength against a lateral force.

SOLUTION: The wiring board comprises a film substrate 1, a plurality of conductor lines 2 arranged on the film substrate 1, and a bump electrode 3 formed on each conductor line. The bump electrode traverses the conductor line and stretches to the opposite sides thereof. The bump electrode has such a cross-section in the width direction as being bonded to the upper surface and the opposite side faces of the conductor line.

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