发明名称 PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMING METHOD USING THE SAME AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive element capable of ensuring satisfactory sensitivity and resolution and capable of obtaining a good resist shape, when light having a wavelength of 400-450 nm is used as exposure light. SOLUTION: The photosensitive element comprises a support film X and a photosensitive resin composition layer Z. A photosensitive resin composition as the material of the layer Z contains a binder polymer A, a photopolymerizable compound B having at least one polymerizable ethylenically unsaturated bond and a photopolymerization initiator C, wherein at least a 4,4'-bis(dialkylamino)benzophenone and/or a 4,4'-bis(alkylamino)benzophenone is contained as a constituent in the initiator C, and a thickness Q [μm] of the layer Z, gross mass Wa [g] of the polymer A in the layer Z, gross mass Wb [g] of the compound B in the layer Z and mass Wc [g] of the above benzophenone in the layer Z are regulated so as to simultaneously satisfy conditions represented by the expressions (1): P=äWc/(Wa+Wb)}×100, (2): P×Q=R, (3): 6.5≤R≤17.5. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004326084(A) 申请公布日期 2004.11.18
申请号 JP20040066301 申请日期 2004.03.09
申请人 HITACHI CHEM CO LTD 发明人 ITO TOSHIKI;ICHIHASHI YASUHISA
分类号 G03F7/031;G03F7/004;H05K3/00;H05K3/06;H05K3/18 主分类号 G03F7/031
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