发明名称 DIE FOR INJECTION MOLDING, PLATING METHOD, AND PLATING TOOL
摘要 PROBLEM TO BE SOLVED: To provide a plating method capable of obtaining a die for injection molding having a satisfactory molded face free from roughness and further having a long service life in a plating method for a die for injection molding comprising a stock consisting essentially of beryllium copper. SOLUTION: The plating method is the treatment of applying plating, e.g., to the surface of a die for injection molding consisting of beryllium copper as the stock. In the method, successively to degreasing treatment 1, electrolytic activation treatment 2 is performed, then, nickel strike plating treatment 3 and mat nickel plating treatment 4 are performed, further, amorphous electroless nickel plating treatment 5 and passivation treatment 6 are performed, and finally, posttreatment 7 such as water washing treatment, pure hot water washing and drying is performed. By the plating treatment, the die for injection molding free from surface roughness, reduced in the change of dimensions and having a long die life can be obtained. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004323945(A) 申请公布日期 2004.11.18
申请号 JP20030122829 申请日期 2003.04.25
申请人 OLYMPUS CORP 发明人 AJISAWA KENGO
分类号 B29C33/38;C23C18/31;C23C22/24;C23C28/00;C25D7/00;(IPC1-7):C25D7/00 主分类号 B29C33/38
代理机构 代理人
主权项
地址