| 摘要 |
A process is for the simultaneous polishing of the front surface and the back surface of a semiconductor wafer between two rotating polishing plates covered with polishing cloth while a polishing fluid is supplied, the polishing cloth of the lower polishing plate having a smooth surface and the polishing cloth of the upper polishing plate having a surface which is interrupted by channels. The semiconductor wafer lying in a cutout in a carrier plate is held on a defined geometric path. The front surface of the semiconductor wafer, during polishing, is in contact with the polishing cloth of the lower polishing plate. The back surface of the semiconductor wafer, during polishing, is in contact with the polishing cloth of the upper polishing plate.
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