发明名称 |
Heat dispersion system e.g. for computer, has heat exhaust device with upper and lower heat sinks which are fastened together with cooling chip embedded between two heat sinks |
摘要 |
<p>The system has a heat exhaust device with upper and lower heat sinks (1, 2) which are fastened together. A cooling chip is embedded between the two heat sinks. A box type extends from housing where the box receives warmth of the heat exhaust. A channel is formed in the housing with an open end.</p> |
申请公布号 |
DE202004013725(U1) |
申请公布日期 |
2004.11.18 |
申请号 |
DE20042013725U |
申请日期 |
2004.09.02 |
申请人 |
WAFFER TECHNOLOGY CORP., TAOYUAN;WANG, JACK |
发明人 |
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分类号 |
G06F1/20;H01L23/467;(IPC1-7):G06F1/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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