发明名称 Heat dispersion system e.g. for computer, has heat exhaust device with upper and lower heat sinks which are fastened together with cooling chip embedded between two heat sinks
摘要 <p>The system has a heat exhaust device with upper and lower heat sinks (1, 2) which are fastened together. A cooling chip is embedded between the two heat sinks. A box type extends from housing where the box receives warmth of the heat exhaust. A channel is formed in the housing with an open end.</p>
申请公布号 DE202004013725(U1) 申请公布日期 2004.11.18
申请号 DE20042013725U 申请日期 2004.09.02
申请人 WAFFER TECHNOLOGY CORP., TAOYUAN;WANG, JACK 发明人
分类号 G06F1/20;H01L23/467;(IPC1-7):G06F1/20 主分类号 G06F1/20
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