| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a process for producing a wiring board with solder bumps in which a micropad and a solder bump can be bonded rigidly. <P>SOLUTION: The process for producing a wiring board comprises a step for forming, on the surface of an insulating substrate 1 having wiring conductors 2, with a plurality of solder bonding pads 3 connected with the wiring conductors 2 and a resin layer 4 having an opening 4a for exposing the central part of the pad 3, a step for applying a metal layer 11 forming solid solution with solder on the inner side face of the opening 4a, and a step for forming a solder bump 5 by coating the inner surface of the opening 4a with solder paste and then heating the solder paste. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
