发明名称 MOUNTING STRUCTURE OF CAMERA MODULE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a mounting structure wherein no soldering is required, and a camera module can be incorporated into a substrate by a single work. <P>SOLUTION: The camera module 1 is incorporated into the substrate 2 to form this mounting structure. The substrate 2 on which a contact terminal 3 is formed is held between the camera module 1 and a connector housing 4, the camera module 1 is attached and fixed to the substrate 2, and the contact terminal 3 formed on the substrate 2 is brought into contact with and fixed to the connecting terminal part of the camera module 1. The substrate 2 is a flexible substrate for example. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004327298(A) 申请公布日期 2004.11.18
申请号 JP20030121947 申请日期 2003.04.25
申请人 MITSUMI ELECTRIC CO LTD 发明人 NISHIO ATSUSHI;KAWASAKI TAKASHI;KARAHASHI SATOSHI
分类号 H01R12/28;H01R33/76;H05K1/18;(IPC1-7):H01R33/76 主分类号 H01R12/28
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