发明名称 METHOD AND DEVICE FOR DRYING SEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for drying semiconductor substrate by which the yield can be improved at the time of manufacturing a semiconductor device by quickly drying a cleaned semiconductor substrate by producing few water marks even when the substrate has a hydrophobic surface. SOLUTION: The device dries the cleaned semiconductor substrate 3 by rotating the substrate 3 around its axis at a high speed by means of a driving section 16 while the substrate 3 is horizontally held on a spin chuck 15. The driving section 16 is provided with a motor 21 which rotationally drives the spin chuck 15 by supporting the chuck 15 in a state where the chuck 15 can be elevated and lowered in the direction of the rotation axis, and a direct-acting actuator 23 which gives acceleration to the motor 21 in the direction of the rotation axis. When the actuator 23 starts to rise the spin chuck 15 holding the semiconductor substrate 3 in the direction of the rotation axis, the motor 21 simultaneously starts to rotate the chuck 15. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004327490(A) 申请公布日期 2004.11.18
申请号 JP20030115970 申请日期 2003.04.21
申请人 TOSHIBA CORP 发明人 EZAKI AKIRA
分类号 F26B5/08;F26B11/18;H01L21/304;(IPC1-7):H01L21/304 主分类号 F26B5/08
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