发明名称 MAPPING PROJECTIION ELECTRON BEAM DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a mapping projection electron beam device with high resolution and high throughput in which a sample can be irradiated by a face beam. SOLUTION: The mapping projection system electron beam device EBI which can irradiate the sample W by a primary electron to form the face beam is equipped with an electron gun EG to eject the primary electron, a primary optical system 2 to adjust a beam shape of the primary electron from the electron gun EG, a Vienna filter 3 to change a traveling direction of the primary electron which has passed through the primary optical system 2, a lens system 5 to adjust the beam form of the primary electron from the Vienna filter 3 and to irradiate the sample W by means of the face beam, secondary optical systems 6, 7 to guide a secondary electron ejected from the sample W, and a secondary electron detection system 8 to detect the secondary electron from the secondary optical systems. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004327121(A) 申请公布日期 2004.11.18
申请号 JP20030117014 申请日期 2003.04.22
申请人 EBARA CORP 发明人 SATAKE TORU;NOMICHI SHINJI;SOFUGAWA TAKUJI;HATAKEYAMA MASAKI;MURAKAMI TAKESHI;WATANABE KENJI;KANEUMA TOSHIFUMI;KARIMATA TSUTOMU
分类号 H01L21/66;H01J37/05;H01J37/12;H01J37/244;H01J37/28;(IPC1-7):H01J37/28 主分类号 H01L21/66
代理机构 代理人
主权项
地址