| 摘要 |
PROBLEM TO BE SOLVED: To produce a high quality printed wiring board having high dimensional accuracy. SOLUTION: When a printed wiring board is produced by pasting a wiring board 4 and a cover lay film 5, the wiring board 4 obtained by forming a circuit 3 on the surface of a base substrate 1 and the cover lay film 5 provided with an adhesive layer 6 are laid in layer while being aligned to produce a sheet 10 which is then set in a hot press 20. The entire sheet is hot pressed stepwise by repeating partial hot press thus pasting the wiring board 4 and the cover lay film 5. COPYRIGHT: (C)2005,JPO&NCIPI
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