发明名称 Semiconductor device
摘要 A semiconductor device comprising: a support substrate; an embedded insulating layer formed on the support substrate; a semiconductor layer on the embedded insulating layer; at least an element region formed in the semiconductor layer; a plurality of source/drain regions of a first conductivity type, formed in the element region at predetermined intervals; a plurality of body regions of a second conductivity type, sandwiched between a pair of adjacent ones of the source/drain regions in the element region; and a gate formed on each of the body regions with a gate insulating film being laid between them, each of the source/drain regions including: an inner high-concentration portion extending to the embedded insulating layer, and an outer low-concentration portion surrounding the inner high-concentration portion and having a direct contact with the body regions.
申请公布号 US2004227248(A1) 申请公布日期 2004.11.18
申请号 US20040791749 申请日期 2004.03.04
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 FUKUZUMI YOSHIAKI;KAJIYAMA TAKESHI
分类号 H01L21/762;H01L21/336;H01L21/76;H01L21/8222;H01L21/8242;H01L21/84;H01L27/108;H01L27/12;H01L29/786;(IPC1-7):H01L21/822 主分类号 H01L21/762
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