SEMICONDUCTOR WAFER, PANEL AND ELECTRONIC COMPONENT COMPRISING STACKED SEMICONDUCTOR CHIPS, AND METHOD FOR THE PRODUCTION THEREOF

摘要

The invention relates to a semiconductor wafer, a panel, an electronic component (26), and a method for the production thereof. Said electronic component (26) comprises a stack consisting of two semiconductor chips (4, 10). The top stacked semiconductor chip (10) is thinly ground and is disposed on a central area (5) of the bottom semiconductor chip (4) according to the flip chip technique. Contacts which contact a rewiring layer (22) through a leveling layer (12) are arranged in an edge area (7) of the bottom semiconductor chip (4). The rewiring layer (22) supports external contacts (25).