发明名称 |
UV- und thermisch härtbare Gießharzformulierung und ihre Verwendung zum Unterfüllprozeß bei elektrischen und elektronischen Bauelementen |
摘要 |
UV-hardenable and thermally hardenable epoxy resins for the underfilling process in electrical and electronic components are provided. A new casting resin component has an increased storage stability at room temperature of at least 6 months and improved characteristics for the underfilling process including faster hardening and lower viscosity. Filler material with a maximum grain size of 20 mum and a siloxane component are provided in addition to the casting resin formulation. |
申请公布号 |
DE19638630(B4) |
申请公布日期 |
2004.11.18 |
申请号 |
DE1996138630 |
申请日期 |
1996.09.20 |
申请人 |
SIEMENS AG |
发明人 |
LEHNER, BARBARA;SEZI, RECAI |
分类号 |
C08K3/00;C08F2/46;C08G59/18;C08G59/68;C08K3/36;C08L63/00;C08L83/08;G03F7/038;G03F7/075;H01L21/56;(IPC1-7):C08L63/00;C08L83/04;C08J3/28;H01B3/40;H01L23/29;H05K3/30;H01B3/46 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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