| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM RESIST USING THE SAME |
| 摘要 |
<p>The present invention relates to an alkali-soluble photosensitive resin composition and a dry film resist using the same, more particularly to a photosensitive resin composition having superior heat resistance, chemical resistance and long-time stability and good adhesivity to a Cu or ITO (indium tin oxide) substrate by containing an acrylate resin, which is effective in improving adhesivity, and a photosensitive dry film resist using the same.</p> |
| 申请公布号 |
WO2004099876(A1) |
申请公布日期 |
2004.11.18 |
| 申请号 |
WO2004KR01049 |
申请日期 |
2004.05.06 |
| 申请人 |
DONGJIN SEMICHEM CO., LTD.;KIM, BONG-GI;PARK, SEONG-MO;PARK, CHAN-SEOK |
发明人 |
KIM, BONG-GI;PARK, SEONG-MO;PARK, CHAN-SEOK |
| 分类号 |
C08F230/02;G03F7/039;C08F220/06;C08F220/18;G03F7/033;(IPC1-7):G03F7/039 |
主分类号 |
C08F230/02 |
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