发明名称 CURING AGENT FOR EPOXY RESIN
摘要 PROBLEM TO BE SOLVED: To provide a curing agent for an epoxy resin, which allows a formed cured product to have excellent heat resistance or the like. SOLUTION: The curing agent for an epoxy resin contains a compound expressed by general formula (1). In formula (1), R<SP>1</SP>to R<SP>6</SP>each independently represent 1-8C substituted or unsubstituted alkylene groups; X<SP>1</SP>to X<SP>12</SP>each independently represent 1-10C substituted or unsubstituted alkyl groups, 2-10C substituted or unsubstituted alkenyl groups, 2-10C substituted or unsubstituted alkynyl groups, 7-10C substituted or unsubstituted aralkyl groups, 1-10C substituted or unsubstituted alkoxy groups, or substituted or unsubstituted phenoxy groups; Z<SP>1</SP>to Z<SP>24</SP>each independently represent hydrogen atoms, groups having a polymerizable functional group, groups having an alkali-soluble group or 1-8C substituted alkyl groups, or 1-8C substituted or unsubstituted alkylene groups formed by coupling two Z adjacent to each other (however, at least two in Z<SP>1</SP>to Z<SP>24</SP>are hydrogen atoms); and q<SP>1</SP>to q<SP>12</SP>each independently represent integers of 0 or 1. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009084344(A) 申请公布日期 2009.04.23
申请号 JP20070253647 申请日期 2007.09.28
申请人 JSR CORP 发明人 TANABE TAKAYOSHI;KAWAGUCHI KAZUO
分类号 C08G59/62;C07C37/20;C07C39/17 主分类号 C08G59/62
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