| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming metal mold of a semiconductor device with which an unfilled part and a void are prevented without working an exterior surface, and to provide a method for manufacturing it. SOLUTION: A plate-like basing material 6 on which semiconductor elements 4 and 5 are mounted is sandwiched between an upper mold 2 and a lower mold 3. A melting resin is inpoured from a resin fill port 8 into a cavity 7 in which the semiconductor elements 4 and 5 are housed, to fill, and further the air is released from air vents 10-12 communicated with the cavity 7, for resin sealing. In a forming metal mold 1 of the semiconductor device performing resin sealing in such a way, the air vents 10-12 are provided to a plurality of points. A cross-sectional area of the air vent 12 communicated to the part of large flow path resistance in the cavity 7 is made larger than that of the other air vents 10 and 11. Further, the cross-sectional area of the air vent 12 is made larger to make resistance of a specified flow path in the cavity 7 small so that the resin is made easy to flow, so that the air vents 10-12 are prevented from being closed with the resin. COPYRIGHT: (C)2005,JPO&NCIPI |
