RESIN SEALED SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a thinned and high mass-productivity structure in a resin-sealed semiconductor device wherein a semiconductor element is laminated on a semiconductor element in a peripheral pad array as one package. SOLUTION: Respective terminal members are aligned in the same direction to respectively align on one plane front and rear surfaces of an external terminal part 111 and a terminal surface of an internal terminal part 112, a half etching surface 150a of a die pad 150 is directed oppositely to a half etching surface 114a of a lead part to align a non-etching surface that is not the half etching surface, on one plane with a non-etching surface of the external terminal part on the half etching surface side of the terminal member, and the terminal surface side of the internal terminal part is disposed on the half etching surface side of the lead part in each terminal member to expose the non-half etching surface and the outside surface of each external terminal part and to dispose the other surfaces within a resin for resin sealing. COPYRIGHT: (C)2005,JPO&NCIPI