发明名称 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
摘要 |
An external terminal is formed on an interconnect pattern formed on a substrate by using a soldering material. Subsequently, a chip component having an electrode is mounted on the substrate. An interconnect for electrically connecting the electrode and the interconnect pattern is formed at a temperature lower than a melting point of the soldering material.
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申请公布号 |
US2004229418(A1) |
申请公布日期 |
2004.11.18 |
申请号 |
US20040788447 |
申请日期 |
2004.03.01 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HASHIMOTO NOBUAKI |
分类号 |
H01L23/12;H01L21/60;H01L23/14;H01L23/31;H01L25/065;H01L29/06;(IPC1-7):H01L21/336 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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