发明名称 |
SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING REFLECTION PLATE WITH HEAT DISSIPATION FUNCTION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device having a reflection plate with heat dissipation function for dissipating heat produced from an LED chip to an outside by constituting the reflection plate enclosing a light emitting element of a substance which is excellent not only in reflectance but also in thermal conductivity. <P>SOLUTION: The device is constituted of at least one or more semiconductor light emitting element for radiating blue light and a reflection plate which rises from the bottom of a base substrate by a fixed height and encloses the semiconductor light emitting element. The reflection plate consists of a material with high light reflectance of a surface and high thermal conductivity, reflects light radiated from a light emitting element and forms uniform plane light, dissipates heat radiated from the light emitting element to an outside, absorbs at least a part of the blue light radiated from the light emitting element and projects white light to an outside of the device with a combination of the blue light radiated from the light emitting element and light of other wavelength comprising a light transmitting cover layer wherein a color conversion substance for radiating the light of other wavelength is contained. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2004327863(A) |
申请公布日期 |
2004.11.18 |
申请号 |
JP20030122701 |
申请日期 |
2003.04.25 |
申请人 |
GRAPHIC TECHNO JAPAN CO LTD;HAYASHIMOTO YOSHIAKI;SEO YOUNG-JOO |
发明人 |
HAYASHIMOTO YOSHIAKI;SEO YOUNG-JOO |
分类号 |
H01L33/32;H01L33/44;H01L33/50;H01L33/56;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L33/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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