| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method of a wiring board which holds a board more easily and stably, prevents thermal deformation in a reflow, realizes narrow pitch connection in thinner wiring boards, and attains more reduction in size and weight of an electronic apparatus. <P>SOLUTION: In this mounting method of wiring board, joint members are placed on a prescribed position of the wiring board, then the wiring board is attached to an implement to apply a constant tension to the wiring board by a prescribed method from the implement. An electronic component is mounted on the wiring board applied with the tension. The wiring board is heated under this tensed condition to connect the electronic component to the wiring board with the joint members. In this way, the electronic apparatus is downsized and reduced in its weight. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
