发明名称 LAMINATING APPARATUS AND LAMINATING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To simultaneously and parallel laminate a plurality of narrow width half-wave plates 2 onto a substrate 1 without air bubbles to enter in-between employing a simple apparatus. <P>SOLUTION: A substrate 1 is sucked and held on a suction table 16 which is provided on a single axis stage 14 that is arranged in a movable manner along rails 12a and 12b. A rotary table 22 and an elastic roller 21 are arranged on a rotary plate 20 which is provided freely rotatably by a journaling section 19a located on top of a pillar 11 and the half-wave plates 2 are disposed on top of the rotary table 22 and is held, for example, by suction. The sucked half-wave plates 2 are opposed to the substrate 1 at an angle of four degrees for example and the elastic roller 21 is pressed to the substrate 1 side by acting the driving shaft edge of a second air cylinder 23 onto a rotary action piece 19. In such a state, the suction table 16 is moved along the rails 12a and 12b to laminate the substrate 1 and the half-wave plates 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004325547(A) 申请公布日期 2004.11.18
申请号 JP20030116799 申请日期 2003.04.22
申请人 SONY CORP 发明人 HAMAYA HIDEKI
分类号 G02B7/00;B29C65/78;G02B5/30;G02F1/13363 主分类号 G02B7/00
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