| 摘要 |
PROBLEM TO BE SOLVED: To provide a compound substrate having a high bonding reliability between a ceramic substrate and a metal member, and is superior in productivity, and to provide a method of manufacturing it. SOLUTION: The compound substrate comprises a ceramic substrate 3, a metal member 1 with its concave part 2 formed at the bonding surface with the ceramic substrate 3, and bonding layers 4 formed in between a bottom 2a of the concave part 2, and the surface of the ceramic substrate 3, and in between the surface of a bank 2c of the metal member 1 and the surface of the ceramic substrate 3. The ceramic substrate 3 and the metal member 1 are bonded by the bonding layer 4. COPYRIGHT: (C)2005,JPO&NCIPI |
